Breaking the CPO Manufacturing Bottleneck: Modular Connectivity and High-Speed Multichannel Active Alignment

About the Webinar

The rapid growth of AI-driven data centers is pushing traditional networking hardware to its limits. To meet the demand for higher bandwidth and lower power consumption, the industry is transitioning toward Co-Packaged Optics (CPO). While CPO offers significant performance advantages, it introduces a major manufacturing challenge: how do you reliably connect, test, and assemble thousands of optical fibers onto a single silicon chip? This webinar explores a collaborative solution to these “scale-up” challenges, featuring the latest innovations from SENKO, Santec, and Aerotech. We will discuss how moving away from fixed, permanent cabling toward a modular approach is essential for high-volume production.