PICAlign™: Revolutionizing Active Alignment for Co-Packaged Optics
At OFC 2026, experts from Aerotech, Santec and Senko discussed their collaborative multichannel active alignment solution, PICAlign™. As Co-Packaged Optics (CPO) become a dominant force in AI and data center infrastructure, the need for rapid, high-precision alignment has reached a critical point. The team explains how PICAlign™ addresses manufacturing bottlenecks by performing multichannel active alignment in six degrees of freedom. This breakthrough allows for faster, more accurate testing across the entire supply chain, from wafer testing to finished goods, ensuring scalability for the next generation of optical devices.
