Webinar
Breaking the CPO Manufacturing Bottleneck: Modular Connectivity and High-Speed Multichannel Active Alignment
About the Webinar
The rapid growth of AI-driven data centers is pushing traditional networking hardware to its limits. To meet the demand for higher bandwidth and lower power consumption, the industry is transitioning toward Co-Packaged Optics (CPO). While CPO offers significant performance advantages, it introduces a major manufacturing challenge: how do you reliably connect, test, and assemble thousands of optical fibers onto a single silicon chip?
This webinar explores a collaborative solution to these “scale-up” challenges, featuring the latest innovations from SENKO, Santec, and Aerotech. We will discuss how moving away from fixed, permanent cabling toward a modular approach is essential for high-volume production.
Justin Bressi is Aerotech’s business development manager for precision automation market segments, including semiconductor, photonics, optics, aerospace, R&D and inspection systems. He has 10+ years of experience in precision motion systems and robotics, holding roles in applications engineering, field sales and business development. Justin earned his bachelor's degree in mechanical engineering and his master’s degree in business administration from the University of Pittsburgh.