Scaling Co-Packaged Optics: A Multichannel Architectural Approach to Active Alignment
As the demand for AI-driven bandwidth pushes data center interconnects toward 3.2T and 6.4T capacities, the industry faces a critical manufacturing hurdle: the precise alignment of high-density fiber arrays. Traditional serial alignment processes are no longer viable for the sub-micron, multi-axis requirements of Co-Packaged Optics (CPO).
