RESOURCES
The resources you need, when you need them.
Access software downloads and activations, white papers, manuals, help files, CAD files and more.
Educational Library
PICAlignâ„¢: Revolutionizing Active Alignment for Co-Packaged Optics
At OFC 2026, experts from Aerotech, Santec and Senko discussed their collaborative multichannel active alignment solution, PICAlignâ„¢. As Co-Packaged Optics (CPO) become a dominant force in AI and data center infrastructure, the need for rapid, high-precision alignment has reached a critical point. The team explains how PICAlignâ„¢ addresses manufacturing bottlenecks by performing multichannel active alignment in six degrees of freedom. This breakthrough allows for faster, more accurate testing across the entire supply chain, from wafer testing to finished goods, ensuring scalability for the next generation of optical devices.
Scaling Co-Packaged Optics: A Multichannel Architectural Approach to Active Alignment
As the demand for AI-driven bandwidth pushes data center interconnects toward 3.2T and 6.4T capacities, the industry faces a critical manufacturing hurdle: the precise alignment of high-density fiber arrays. Traditional serial alignment processes are no longer viable for the sub-micron, multi-axis requirements of Co-Packaged Optics (CPO).
The Aerotech Difference: Co-Packaged Optics Manufacturing
In this age of information, we rely on data moving instantly across the globe. As our hunger for AI grows, the physical connections moving that data are hitting a limit. That’s where Aerotech steps in.
Boosting Throughput and Precision in Medical Device Manufacturing with Automation1 PWM+ Amplifiers
The Challenge: Maximize Throughput and Maintain Quality in Laser…
The New Optical Interface: Novel Connector Designs and Intelligent Alignments Enable the CPO Era
It is no secret that scaling networks for future AI workloads has become increasingly difficult due to rising power demands and the extraordinary quantity of optical interconnects. For years, optical networks relied on faceplate pluggable (FPP) transceivers. Today, it is clear that this strategy has reached its limits.
Motion for Advanced Packaging
Advanced packaging is pushing motion control from a supporting role into a yield-critical discipline. As tolerances compress into the nanometer range, equipment builders must rethink how mechanics, sensing, and control interact. This whitepaper examines the system-level motion design principles shaping next-generation semiconductor manufacturing.
Microelectrode array manufacturing advances provide device designers with scaling options
Advanced laser micromachining technology significantly reduces production complexity, increases efficiency, and ultimately lowers costs. A combination of modern motion controls, precision stages, and five-axis precession laser scanners provides designers with a new tool for scaling device production.
PWM+ Product Solution Sheet
PWM+ Solution Sheet 10.2025Download
Highly dynamic motion systems for stent processing
The production of microtubes for stents, catheters, or biopsy cannulas requires laser cutting processes that guarantee both the highest precision and high throughput. This places high demands on the motion technology: only when the drive, control, and mechanics are perfectly coordinated can fine cuts be achieved in short cycle times.
