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Podcast Chat: Aerotech: Displaying the Future of Innovation
Hear an interview with Brian O’Connor, vice president of Growth and Strategy at Aerotech and Laser Focus World Following the Photons podcast host Justine Murphy at the SPIE Photonics West exhibition in San Francisco. Brian talks about the company and its innovative products, as well as his thoughts and insight into the photonics industry overall, specifically how co-packaged optics is revolutionizing the datacom and semiconductor industries, and Aerotech’s contribution to it.
Aerotech quick chat: Co-packaged optics & the active alignment breakthrough
Discover how co-packaged optics is reshaping the future of photonics manufacturing — and why active alignment has become a critical challenge to solve. In this episode of Following the Photons, Aerotech’s Justin Bressi joins host Justine Murphy to discuss how Aerotech’s new PICAlignTM architecture is helping to improve alignment precision, throughput and efficiency for next-generation optical device assembly.
Beyond PID – Frequency Domain Strategies for High Throughput Motion
Whether your goal is sub-micron precision or maximizing parts-per-hour, the bottleneck is the same: the system’s mechanical limits and the impact of environmental disturbances. Traditional time-domain tuning often leaves performance on the table or results in systems that are sensitive to minor process disturbances.
PICAlignâ„¢: Revolutionizing Active Alignment for Co-Packaged Optics
At OFC 2026, experts from Aerotech, Santec and Senko discussed their collaborative multichannel active alignment solution, PICAlignâ„¢. As Co-Packaged Optics (CPO) become a dominant force in AI and data center infrastructure, the need for rapid, high-precision alignment has reached a critical point. The team explains how PICAlignâ„¢ addresses manufacturing bottlenecks by performing multichannel active alignment in six degrees of freedom. This breakthrough allows for faster, more accurate testing across the entire supply chain, from wafer testing to finished goods, ensuring scalability for the next generation of optical devices.
Scaling Co-Packaged Optics: A Multichannel Architectural Approach to Active Alignment
As the demand for AI-driven bandwidth pushes data center interconnects toward 3.2T and 6.4T capacities, the industry faces a critical manufacturing hurdle: the precise alignment of high-density fiber arrays. Traditional serial alignment processes are no longer viable for the sub-micron, multi-axis requirements of Co-Packaged Optics (CPO).
The Aerotech Difference: Co-Packaged Optics Manufacturing
In this age of information, we rely on data moving instantly across the globe. As our hunger for AI grows, the physical connections moving that data are hitting a limit. That’s where Aerotech steps in.
Boosting Throughput and Precision in Medical Device Manufacturing with Automation1 PWM+ Amplifiers
The Challenge: Maximize Throughput and Maintain Quality in Laser…
The New Optical Interface: Novel Connector Designs and Intelligent Alignments Enable the CPO Era
It is no secret that scaling networks for future AI workloads has become increasingly difficult due to rising power demands and the extraordinary quantity of optical interconnects. For years, optical networks relied on faceplate pluggable (FPP) transceivers. Today, it is clear that this strategy has reached its limits.
Motion for Advanced Packaging
Advanced packaging is pushing motion control from a supporting role into a yield-critical discipline. As tolerances compress into the nanometer range, equipment builders must rethink how mechanics, sensing, and control interact. This whitepaper examines the system-level motion design principles shaping next-generation semiconductor manufacturing.
